Aerospace & Defense
Aluminum silicon carbide (AlSiC) offers excellent thermal management performance, light weight, and high stability, making it particularly suitable for aerospace and defense applications, such as satellite structural components, optical mechanical structures, precision components for airborne optoelectronic platforms, and high-gain antenna supports. It serves as a heat-dissipating substrate/baseplate for electronic packaging, for example, in power modules for radar systems and radio frequency (RF) equipment.
Telecommunications AI Computing
It is used as a heat dissipation lid and heat sink material for high-end AI chips (GPUs, ASICs). Chips generate a lot of heat when performing large-scale machine learning and deep learning operations. AlSiC has light weight and excellent heat dissipation performance, which can realize more efficient and compact cooling solutions and improve overall computing density and energy efficiency.
Transportation
Aluminum silicon carbide (AlSiC) combines the light weight of aluminum alloy with the high hardness and high strength of silicon carbide. In the field of transportation, it is used in key components that require light weight, high rigidity, and excellent heat dissipation. Including:
- Rail and Rail Transit: Used for heat dissipation substrates or housings for traction inverters, power modules, and electronic control units (ECU).
- Electric Vehicles (EV) and Hybrid Electric Vehicles (HEV): Used as heat sinks or structural components for battery management systems (BMS), power modules, inverters, and DC-DC converters.
Energy Industrial
Aluminum silicon carbide (AlSiC) is a high-performance composite material that combines the metallic properties of aluminum alloys with the advantages of silicon carbide ceramics, and has a wide range of applications in the industrial and energy fields.
- Renewable Energy Equipment: Used in solar inverters and wind turbine components, where efficient heat dissipation is critical to maintaining system performance.
- Power Electronic Equipment: Used for power semiconductor modules for grid upgrades, enabling higher power density and smaller package volumes.