RPI SYSTEM

Features

Production traceability down to every PCB
Data management for soldering quality and throughput
Lower production costs
Production quality control independent of equipment, operator and environmental factors
Automated thermal profiling

A reflow oven is a very busy machine: it must heat and cool PCBs efficiently while controlling many variables at once. In the end, it has to deliver:

KIC RPI collects and optimizes both streams of continuous production data, and provides statistics and reports.

PCB thermal profile charts
Automatic profile yield evaluation
Real-time production details
- Number of PCBs produced
- Product name and lot number
- Production date and timestamp
- Reflow oven name
Full production traceability

Total defect opportunities
Boards processed × Measurement points × Process windows = Total defect opportunities (2 x 5 x 5 =50)

DPMO (defects per million opportunities)
Defect points ÷ Total defect opportunities × 1,000,000 (4÷50×1,000,000=80,000)

Yield
100 ÷ Boards processed × Failed boards = Failure rate %, 100% – Failure rate % = Yield


Accuracy	± 2°F (1.2°C)
Readings/second	13
Thermocouples	Type K
Temperature Range	-150°C to 450°C
Dimensions
Data acquisition unit (LxWxH):	308.6mm x 173.5mm x 35.8mm
Probes	length and thermocouple spacing is customized to each oven
Communications	Ethernet, RJ-45 connector
Computer Capability	PC
Power Requirements	12V DC @ 300mA

Note: Must be used with a KIC profiler