TOSHIBA Nanofocus X-ray Inspection System
TXLamino
Objects that were once hard to see are now easy to observe!
Equipped with a 4K monitor & megapixel X-ray detector
Equipped with a 4K monitor & megapixel X-ray detector
High Resolution
Equipped with a nanofocus X-ray source
Glass-metal high-definition X-ray image intensifier
Automatic field-of-view centering during tilt and rotation
High Image Quality
4K monitor
Orthogonal CT (optional)
High Definition
Equipped with a 4-megapixel camera
Lamino CT (oblique CT)
Specifications
Main Specifications
| Item | Specification |
| X-ray source | Open-type transmission tube |
| Tube voltage / tube current setting (max.) | 160kV/200μA |
| X-ray focal spot size | 0.25pm |
| X-ray detector | High-definition beryllium-window X-ray image intensifier (4/2 inch)*1 |
| Camera effective pixels | 4 megapixels |
| Output gray levels | 16bit |
| X-ray geometric magnification | 2000× (theoretical) |
| Mechanism | 6 axes (tilt and rotation type) |
| Stage X/Y travel range | 300mm × 300mm |
| Stage rotation range | 0°~360° (horizontal rotation) |
| Tilt range (X-ray detector) | 0°~60° |
| Field-of-view tracking | Automatic tracking of the field-of-view center during tilt and rotation |
| Display range adjustment | Automatic adjustment / manual operation |
| Lamino CT (oblique CT) | CT data acquisition (any tilt angle) |
| Viewing window | Lead glass |
| External dimensions | Inspection chamber: approx. W1600 × D1600 × H2000mm |
| Operation console: approx. W1600 × D800 × H750mm (desk height) | |
| Radiation leakage | 1μSv/h or less |
| Applications | High-density PCBs, electronic components, etc. |
*1: X-ray I.I. (X-ray image intensifier)
CT Options
| CT function | Specification |
| Orthogonal CT (cone-beam CT) | Orthogonal CT unit (interchangeable stage) |
Image Analysis and Measurement Functions
| Measurement functions | Solder wetting, wire sweep, point-to-point dimension, void calculation, BGA void ratio measurement |
| Analysis functions | Pseudo-color, contour, histogram, 3D display |