Unitemp Vacuum Reflow Oven
VSS-300 / VSS-300-HV
- Vacuum soldering up to 450°C as standard, optionally up to 600°C
- Vacuum used for gas exchange during the process (inert, reducing, oxidizing and cleaning gases)
- Formic acid reduction process, safe and convenient to use
- Vacuum removes bubbles (voids) while the solder alloy is in the liquid phase
- Up to 4 independently controlled gas channels
- Heating and cooling rates closely follow the setpoints
- Small footprint
Applications
- Reflow Solder Processes without flux
- Die attachment
- IGBT/DBC
- IR sensor/Crystal package sealing
- Wafer level packaging
- Low moisture package sealing
- High power LED
- Wafer bump/solder ball reflow