Unitemp Vacuum Reflow Oven VSS-300 Formic Acid Utrun Edition
- Vacuum soldering up to 450°C as standard, optionally up to 600°C
- Convenient use of process gases (inert, reducing, oxidizing and cleaning gases)
- Safe and convenient formic acid process
- Vacuum removes bubbles (voids) while the solder alloy is in the liquid phase
- Up to 4 independently controlled gas channels
- Very fast heating and cooling response
- Small footprint
Applications
- Reflow Solder Processes without flux
- Die attachment
- IGBT/DBC
- IR sensor/Crystal package sealing
- Wafer level packaging
- Low moisture package sealing
- High power LED
- Wafer bump/solder ball reflow
Formic Acid Reduction Examples
Metals other than gold (Au) always oxidize in air, forming an oxide film. If solder is melted in this state, the oxide film repels it and the solder joint is poor.
Therefore, during soldering the oxide film must be removed with flux, or by reducing it with hydrogen or formic acid.
If the solder is joined with only an N2 purge, the oxide film repels the solder.
Example of formic acid reduction soldering using solder preforms.
Formic Acid System
- Gas controller for independent formic acid control (FA II)
- Automatic or manually triggered refilling of the FA module from the FA container
- Keeps the FA module at an appropriate level
- Highly useful for volume production systems
User-Friendly Control Interface
Status Display Screen
Program Setup Screen
| Max. substrate size | 300 x 300 mm |
| Max. temperature | up to 450 °C (optionally up to 600°C) |
| Ramp up rate | 150 K/Min. |
| Ramp down rate | T = 450 °C > 200 °C: 90 K/min, |
| T = 200 °C > 100 °C: 60 K/min | |
| Substrate cooling | by nitrogen gas |
| Chamber cooling | by external water cooling system |
| Vacuum | up to 10-3 hPa (optionally up to 10-6 hPa) |
| Flow meter | Mass Flow Controller for Nitrogen and other inert gases |
| Controller | SIMATIC© with 7″ Touch Panel |
| Heating plate | Isostatic graphite |
| Chamber height inside | 70 mm, optionally 120 mm |
| Programs | 50 programs storable |
| Formic acid module | FAII + FA IV |
| Dimension | 540 x 690 x 890 mm³ |
| Weight | 120 kg |
| Power | 3 x 220 V, 3~+PE△, 16.5 kW, 43.2 A |
| Vacuum Pump | Chemically resistant 2×10-3hPa 3.8 m³/h |
| Item | Description |
| Communication interfaces: | |
| VSS-RC | Remote chamber open/close control module |
| VSS-SI | Serial port with USB 2.0 connection |
| Chamber options: | |
| VSS-EH | Chamber height extended to 120mm |
| VSS-LiftPins | Pneumatic lift pins (for 150mm/200mm/300mm wafers) |
| Thermocouples: (three measuring points as standard) | |
| TC II | In-chamber thermocouple (for external devices) |
| Sensor modules: | |
| MM | Humidity sensor module (can be used as a process trigger) |
| Ox | Oxygen sensor module (can be used as a process trigger) |
| Other options: | |
| VSS-QP | Top shield plate |
| VSS-HT | Max. heating temperature extended from 450°C to 600°C |
| VSS-TH | Top heater (with one additional power supply) |
| VSS-ExOH | Chamber opening increased from 200mm to 300mm height |
| External accessories (vacuum pump, cooling system): | |
| WC III | Closed-loop water cooling system (3.9kW/13ltr 230V, 1P/N/PE/2.4 kW) |
| CRVpro 8 | Acid/alkali-resistant oil-sealed vacuum pump (2×10-3hPa 7.3 m³/h) |