Unitemp VPO-300 / VPO-300-HV Vacuum Process Oven
Unitemp (Germany) VPO-300 vacuum process oven for single 300 mm (12") wafers or 300 × 300 mm substrates. Cross-aligned infrared lamps top and bottom (18 kW each) with 3 programmable zones, up to 1000°C (1200°C optional), 40 K/s ramp-up; vacuum 1×10⁻³ hPa on VPO-300 and 10⁻⁶ hPa on VPO-300-HV, overpressure up to 0.2 MPa optional, up to 4 MFC gas lines.
Manufacturer: Unitemp | Category: Rapid Thermal Processing | Models: VPO-300, VPO-300-HV
Vacuum Rapid Thermal Processing for 300 mm Wafers
The Unitemp (Germany) VPO-300 vacuum process oven handles single 300 mm (12″) wafers, 300 × 300 mm substrates or four 156 mm solar cells. It is designed for 300 mm production lines where energy efficiency, throughput, tight thermal budgets, flexibility and cost matter, and is equally suited to R&D and pilot runs.
Cross-aligned infrared lamp fields above and below the part (18 kW each), with 3 programmable heating zones, heat a silicon wafer to 1000°C (1200°C optional) within seconds at 40 K/s. The lamp arrangement gives uniform temperature and reproducible process parameters: within 1% of set point on a 200 mm wafer (e.g. ±3 K at 300°C).
VPO-300 reaches 1×10⁻³ hPa and VPO-300-HV 10⁻⁶ hPa; overpressure up to 0.2 MPa (2000 hPa) is available as an option. One nitrogen MFC is standard, expandable to 4 lines, for inert gases, oxygen, hydrogen and forming gas; a safety hood (Hood L) is available for pure hydrogen.
The SIMATIC® controller with 7″ touch panel stores 50 programs of 50 steps, with data logging and remote control. The chamber opens and closes by push button for production-line integration, and a floor cabinet with integrated heat exchanger is available.
Models and Specifications
| Item | VPO-300 | VPO-300-HV |
|---|---|---|
| Max. part size | 12" wafer or 300 × 300 mm | |
| Vacuum | 1×10⁻³ hPa | 10⁻⁶ hPa |
| Overpressure | Optional, up to 0.2 MPa (2000 hPa) | |
| Chamber | Aluminum, 350 × 350 mm, with quartz bottom plate (stainless steel optional) | |
| Chamber height (mm) | 50 (120 optional) | |
| Max. temperature | 1000°C (1200°C optional) | |
| Temperature uniformity | ≤ 1% of set temperature (200 mm wafer; e.g. ±3 K at 300°C) | |
| Heating | Cross-aligned IR lamps top and bottom (18 kW each), 3 programmable zones | |
| Max. ramp-up rate | 40 K/s | |
| Ramp-down rate | 1000→400°C: 200 K/min; 400→100°C: 30 K/min | |
| Process gas lines | Nitrogen MFC 5 nlm × 1, up to 4 lines | |
| Controller | SIMATIC® 7" touch panel; 50 programs × 50 steps; data logging, remote control | |
| Cooling | External chamber water cooling; parts cooled by nitrogen | |
| Dimensions (W × D × H) (mm) | 540 × 690 × 890 | |
| Weight (kg) | 140 | |
| Power supply | 2 × 400/230 V, 18 kW | |
Highlighted rows differ between models; values shared by all models are merged into one cell.
For graphite susceptors, wafer lift pins, a quartz top plate, serial interface, remote lid control (not for -HV), a safety hood for pure hydrogen (Hood L), floor cabinets and other options, please contact Utrun-Tech.
For full specifications and dimensional drawings, see the Unitemp VPO series page and datasheet.
Typical Applications
300 mm rapid thermal processing
RTP, RTA, RTO and RTN, contact annealing and dopant activation after implantation, for R&D and production on 300 mm lines.
Thermal oxidation and metal reflow
Thermal oxidation, metal reflow and chemical vapor deposition related processes; optional overpressure up to 0.2 MPa widens the process window.
Alloying and solar cells
SiAu, SiAl and SiMo alloying, low-k dielectrics, crystallization and densification, and Si solar cells on glass by Si wafer bonding; four 156 mm cells per run.
Frequently Asked Questions
How does the VPO-300 differ from the RTP series?
VPO-300 takes 300 mm (12") wafers or 300 × 300 mm substrates, with 18 kW IR lamp fields top and bottom, 3 programmable zones and optional overpressure up to 0.2 MPa. The RTP series goes up to 200 mm wafers, but the smaller models ramp faster (up to 200 K/s). Choose VPO-300 for 12" wafers, large substrates or production; choose RTP for R&D up to 200 mm and very fast ramp-up.
VPO-300 or VPO-300-HV?
The difference is vacuum: 1×10⁻³ hPa on VPO-300, 10⁻⁶ hPa on VPO-300-HV. Heating, temperature, gas and controller specifications are the same. Remote lid control and basic vacuum (VAC I) options are not available for the HV version.
Can pure hydrogen be used?
Yes. The VPO series runs with inert gases, oxygen, hydrogen and forming gas; for 100% hydrogen Unitemp offers a protective safety hood (Hood L), with the H2 sensor, gas box and flame-off unit configured separately. Utrun-Tech can help assess the safety setup for your facility.
Other Rapid Thermal Processing Models
- Unitemp RTP Series Rapid Thermal Processing Ovens — Unitemp (Germany) RTP series rapid thermal processing (RTP/RTA) ovens with top and bottom infrared lamp heating, for wafers up to 100, 150 or 200 mm. Up to 1000°C (1200°C or 1500°C optional by model), single-wafer ramp-up up to 150 K/s (200 K/s optional), vacuum 1×10⁻³ hPa (10⁻⁶ hPa range on HV versions) and up to 4 MFC gas lines — for annealing, oxidation, nitridation and alloying.
A key-spec comparison of every model, with selection notes and FAQs, is in the Rapid Thermal Processing selection guide.
More from Unitemp
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