Unitemp 2Z-HVS Series High Vacuum Sealers
Unitemp (Germany) 2Z-HVS high vacuum sealers for hermetic MEMS sealing and getter activation. Vacuum 10⁻⁶ hPa (pump included), two heating zones in one chamber (top 200°C, bottom 450°C), 20 K/min ramp rates and up to 6 packages per run; 2Z-HVS-100 for parts up to 16 mm in diameter, 2Z-HVS-200 up to 42 mm.
Manufacturer: Unitemp | Category: Vacuum Sealing Equipment | Models: 2Z-HVS-100, 2Z-HVS-200
High Vacuum Hermetic Sealing and Getter Activation for MEMS
The Unitemp (Germany) 2Z-HVS is a high vacuum sealer for hermetically encapsulating MEMS (micro-electro-mechanical systems) at 10⁻⁶ hPa. Compact and relatively light, it fits on a lab bench yet is suitable for production — a cost-effective alternative to larger systems.
One chamber holds two heating zones: the bottom zone reaches 450°C and the top zone 200°C, each with its own ramp rates. Before sealing, parts and lids can be processed at different temperatures — for example activating the getter — and then positioned automatically and sealed at the same temperature.
Up to 6 parts (adapters) are processed per run: 2Z-HVS-100 for parts up to 16 mm in diameter, 2Z-HVS-200 up to 42 mm. Ramp-up and ramp-down are 20 K/min in vacuum, and both hot plate and chamber are water-cooled.
The process chamber is enclosed in a 360° glass cylinder for continuous observation. The SIMATIC® controller can be programmed on the unit, or via USB with the included UniSoft software on a PC.
Models and Specifications
| Item | 2Z-HVS-100 | 2Z-HVS-200 |
|---|---|---|
| Heated area diameter (mm) | 100 | 200 |
| Adapters | Up to 6 | |
| Max. part size | 16 mm diameter | 42 mm diameter |
| Vacuum | 10⁻⁶ hPa (pump included) | |
| Max. temperature | Bottom zone 450°C (600°C optional); top zone 200°C | |
| Ramp-up / ramp-down rate | 20 K/min (in vacuum) | |
| Process gas lines | MFC × 1, up to 4 lines | |
| Cooling | Water-cooled chamber and hot plate | |
| Controller | SIMATIC®; USB interface with UniSoft software; 20 programs × 100 steps | |
| Process observation | 360° glass chamber | |
| Dimensions (W × D × H) (mm) | 200 × 500 × 470 | 805 × 500 × 820 |
| Weight | 24 kg + pump | 105 kg + pump |
| Power supply | 230 V 1-phase, max. 16 A, 3.2 kW | 230/400 V 3-phase + N, 3 × 16 A, 9 kW |
Highlighted rows differ between models; values shared by all models are merged into one cell.
For additional gas lines (manual flow meter or MFC), thermocouples, a water chiller (WC-I) and other options, please contact Utrun-Tech.
For full specifications and dimensional drawings, see the Unitemp HVS series page and datasheet.
Typical Applications
Hermetic MEMS sealing
Seals up to 6 MEMS packages at 10⁻⁶ hPa, with automatic positioning of part and lid and sealing at the same temperature.
Getter activation
Part and lid are held in the top and bottom zones at different temperatures before sealing, so getter activation and sealing are done in one process.
IR sensor and crystal packaging
Components that must keep an internal vacuum, such as IR sensors and crystal oscillators — validate the sealing process at lab scale before production.
Frequently Asked Questions
What are the two heating zones of the 2Z-HVS for?
In one chamber, the bottom zone reaches 450°C and the top zone 200°C, each with its own ramp rates. Before sealing, the part and lid can be processed at different temperatures — for example activating the getter at a higher temperature — then brought to the same temperature, positioned automatically and sealed.
2Z-HVS-100 or 2Z-HVS-200?
By part size: both process up to 6 parts per run; the 2Z-HVS-100 adapters take parts up to 16 mm in diameter, the 2Z-HVS-200 up to 42 mm. The 2Z-HVS-100 weighs 24 kg (without pump) and runs on single-phase 230 V; the 2Z-HVS-200 weighs 105 kg and needs a 3-phase supply.
Are the vacuum pump and cooling water included?
The pump, slide valve and vacuum gauge for 10⁻⁶ hPa are included. The hot plate is actively water-cooled and the chamber housing also needs cooling; Unitemp recommends a closed-loop water chiller (WC-I).
Other Vacuum Thermal Processing Models
- Unitemp RSO Series Infrared Vacuum Reflow Ovens — Unitemp (Germany) RSO series vacuum reflow ovens with bottom infrared lamp heating: up to 650°C, ramp-up up to 10 K/s and temperature uniformity within 1% of set point. RSO-210 takes 210 × 210 mm substrates or 8" wafers, RSO-300 takes 300 × 300 × 40 mm parts; vacuum 1×10⁻³ hPa (10⁻⁶ hPa range on HV versions), up to 4 MFC gas lines and formic acid flux-free soldering.
- Unitemp RSS Series Benchtop Vacuum Reflow Soldering Systems — Unitemp (Germany) RSS series benchtop vacuum reflow soldering systems for flux-free, low-void soldering. Four models with heated areas from 110 × 110 mm to 310 × 310 mm, up to 400°C (500°C optional), ramp-up up to 180 K/min and vacuum down to 1×10⁻³ hPa; one nitrogen MFC as standard, a built-in formic acid module from RSS-160-SC upward, and a SIMATIC® controller with 7" touch panel storing 50 programs.
- Unitemp VSS Series Vacuum Soldering Systems — Unitemp (Germany) VSS series vacuum soldering systems: VSS-300 for 300 × 300 mm substrates or 300 mm wafers, VSS-620 for large substrates up to 620 × 620 mm. Infrared bottom heating with 3 programmable zones, up to 450°C (600°C optional); vacuum 10⁻³ hPa, 10⁻⁶ hPa on -HV versions; chamber sealed gas-tight from the lamps; inert gas, oxygen, forming gas and formic acid, up to 4 MFC lines.
- Unitemp VSS-300 Vacuum Reflow Oven – Formic Acid Edition — A Utrun-Tech configuration of the Unitemp (Germany) VSS-300 pre-equipped for formic acid reduction soldering: FA II formic acid module (individually controlled gas line) plus FA IV automatic refilling, chemically resistant vacuum pump and isostatic graphite heating plate. Substrates up to 300 × 300 mm, 450°C (600°C optional), 150 K/min ramp-up, 10⁻³ hPa vacuum.
A key-spec comparison of every model, with selection notes and FAQs, is in the Vacuum Thermal Processing selection guide.
More from Unitemp
- Unitemp RTP Series Rapid Thermal Processing Ovens — Unitemp (Germany) RTP series rapid thermal processing (RTP/RTA) ovens with top and bottom infrared lamp heating, for wafers up to 100, 150 or 200 mm. Up to 1000°C (1200°C or 1500°C optional by model), single-wafer ramp-up up to 150 K/s (200 K/s optional), vacuum 1×10⁻³ hPa (10⁻⁶ hPa range on HV versions) and up to 4 MFC gas lines — for annealing, oxidation, nitridation and alloying.
- Unitemp VPO-300 / VPO-300-HV Vacuum Process Oven — Unitemp (Germany) VPO-300 vacuum process oven for single 300 mm (12") wafers or 300 × 300 mm substrates. Cross-aligned infrared lamps top and bottom (18 kW each) with 3 programmable zones, up to 1000°C (1200°C optional), 40 K/s ramp-up; vacuum 1×10⁻³ hPa on VPO-300 and 10⁻⁶ hPa on VPO-300-HV, overpressure up to 0.2 MPa optional, up to 4 MFC gas lines.
- Unitemp WB-300-U Semi-Automatic Wire Bonder — Unitemp (Germany) WB-300-U benchtop semi-automatic wire bonder with three motorized, mouse-controlled axes and 1.0 µm accuracy. Wedge, ball, bump and security ball bonding with a simple tool change, using 17–50 µm gold or aluminum wire; 165 mm deep-access bond head, 62 kHz ultrasonics (0–2 W), 60 mm / 250°C heated stage, motorized wire spool, EFO and a SIMATIC® 7" touch panel.
