Unitemp (Germany) WB-300-U benchtop semi-automatic wire bonder with three motorized, mouse-controlled axes and 1.0 µm accuracy. Wedge, ball, bump and security ball bonding with a simple tool change, using 17–50 µm gold or aluminum wire; 165 mm deep-access bond head, 62 kHz ultrasonics (0–2 W), 60 mm / 250°C heated stage, motorized wire spool, EFO and a SIMATIC® 7" touch panel.
Semi-Automatic Wire Bonding for R&D, Prototyping and Small Batches
The Unitemp (Germany) WB-300-U is a benchtop semi-automatic wire bonder with three motorized, mouse-controlled axes, combining precision with ease of use for R&D, prototyping and small-batch production. Its light weight makes it easy to move and set up.
With a simple tool change, one machine performs wedge, ball, bump and security ball bonding with 17–50 µm gold or aluminum wire. The deep-access bond head has a 165 mm arm, 40 mm Z travel and a 50 × 50 mm XY table, all with 1.0 µm accuracy.
Standard equipment includes a 60 mm heated stage up to 250°C, a motorized wire spool, electronic flame-off (EFO) and an LED gooseneck light. The 62 kHz PLL-controlled ultrasonic system delivers 0–2 W, with bond force 5–300 cN and bond time 5–5000 ms; force, time and power can each be set in three stages.
The SIMATIC® controller with 7″ touch panel stores 50 programs, detects bond height automatically and connects over Ethernet. A microscope, a vertical camera for precise bonding, a horizontal camera for loop inspection and a manual Z lever are available as options.
Bond Head and Work Area
Deep-access bond head
165 mm arm | Z travel 40 mm, accuracy 1.0 µm
Ultrasonic transducer
62 kHz PLL control | 0–2 W
Wedge and ball bonding
Switch by tool change | Gold and aluminum wire 17–50 µm
Benchtop unit
580 × 510 × 490 mm | 45 kg
Models and Specifications
| Item | WB-300-U |
|---|---|
| Bonding methods | Wedge, ball, bump and security ball bonding; switch by tool change |
| Wire | Gold and aluminum wire, 17–50 µm |
| Ultrasonic system | PLL control, 62 kHz transducer (WBT140, wedge and ball); power 0–2 W |
| Bond time | 5–5000 ms |
| Bond force | 5–300 cN |
| Bond head | Motorized deep-access bond head, 165 mm arm; Z travel 40 mm, accuracy 1.0 µm |
| XY table | Motorized, 50 × 50 mm travel, accuracy 1.0 µm; mouse control with programmable ratio |
| Wire spool | Motorized 2" spool (12–50 µm wire), monitored by IR sensor |
| Wire termination | Bond head tear / clamp tear; electronic flame-off (EFO) |
| Heated stage | HP-60: 60 mm diameter, max. 250°C, ±1% control accuracy, height adjustable 66–78 mm |
| Programmable parameters | Bond force, time and power in three stages; loop height, start height, tail length, temperature; automatic bond height detection |
| Controller | SIMATIC® 7" touch panel; 50 programs |
| Lighting and network | LED gooseneck light; Ethernet |
| Options | Microscope (e.g. Leica S6), vertical camera, horizontal camera, manual Z lever |
| Power supply | 100–240 V, 50–60 Hz, max. 5 A |
| Dimensions (W × D × H) (mm) | 580 × 510 × 490 |
| Weight (kg) | 45 |
For full specifications and dimensional drawings, see the Unitemp WB series page and datasheet.
Typical Applications
R&D and prototyping
Wire bonding prototypes of semiconductor devices, sensors and modules; 50 programs keep parameters per product, and changing wire type or bonding method only takes a tool change.
Small-batch production
Motorized axes, mouse control and automatic bond height detection reduce dependence on operator skill — suited to small, high-mix batches.
Deep-access bonding in packages
The 165 mm deep-access bond head reaches inside packages with side walls, for optoelectronics, hybrid circuits and power modules.
Frequently Asked Questions
Can the WB-300-U do both wedge and ball bonding?
Yes. One machine switches between wedge, ball, bump and security ball bonding with a simple tool change. The 62 kHz WBT140 transducer serves both wedge and ball bonding, with 17–50 µm gold or aluminum wire.
How does a semi-automatic wire bonder differ from a manual one?
On a manual bonder, XYZ movement depends on the operator's touch. The WB-300-U drives all three axes by motor under mouse control with 1.0 µm accuracy, detects bond height automatically and stores parameters in 50 programs, reducing dependence on operator experience. A manual Z lever is available as an option.
Do I need a microscope or camera?
The standard unit is used with a microscope (e.g. Leica S6); a vertical camera for precise positioning and a horizontal camera for loop inspection are available as options. Choose according to part size and production needs — Utrun-Tech can help confirm the configuration.